Description
Specification:
Diameter 4.5"/115MM, Bore 22.23MM/7/8", Diamond height 12MM, Segment thickness 2.3MM
Diameter 5"/125MM, Bore 22.23MM/7/8", Diamond height 12MM, Segment thickness 2.3MM
Diameter 7"/180MM, Bore 22.23MM/7/8", Diamond height 12MM, Segment thickness 2.5MM
Diameter 9"/230MM, Bore 22.23MM/7/8", Diamond height 12MM, Segment thickness 2.6MM
Diameter 12"/304MM, Bore 25.4MM, Diamond height 12MM, Segment thickness 3.0MM
Diameter 14"/354MM, Bore 25.4MM, Diamond height 12MM, Segment thickness 3.2MM
Diameter 16"/414MM, Bore 25.4MM, Diamond height 12MM, Segment thickness 3.2MM
Application: Hard material, reinforced concrete, hard granite, hard brick ect.
Feature: Dry cutting, Laser welding provide best welding strength avoid segment-off.
New Technology in diamond array, its 3D distribution guarantees sufficient use of each diamond particle
More efficient, fast and stable in cutting
12MM segment height provide much longer life
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